-40%

Thixotropic Room Temperature Cure Epoxy For No Sag Applications FS291, 2.5gm

$ 5.27

Availability: 47 in stock
  • Model: FS291-10
  • Condition: New
  • MPN: AA-BOND FS291-10
  • All returns accepted: ReturnsNotAccepted
  • Country/Region of Manufacture: United States
  • Brand: Atom Adhesives

    Description

    Technical Product Bulletin
    THIXOTROPIC ROOM TEMPERATURE CURE EPOXY ADHESIVE
    PRODUCT DESCRIPTION:
    AA-BOND FS291 is a thixotropic room temperature cure epoxy adhesive system developed for structural bonding applications on vertical or overhead surfaces where its no-sag characteristics are critical.
    AA-BOND FS291 is medium exotherming system exhibits excellent flow and wetting characteristics.
    GENERAL PROPERTIES:
    Cure Type
    Room temperature or Heat cure
    Benefits
    ·
    Excellent  flow
    ·
    Excellent  wetting characteristics
    ·
    Works on a wide variety of substrates
    Mix Ratio by weight
    100:81 / Resin:Hardener
    Substrates
    Glass, most metals, and variety of plastics
    Typical Application
    Structural bonding, overhead and vertical applications
    Pot Life
    45 minutes
    Solids Content
    100%
    Shelf life
    1 year
    CURE SCHEDULE:
    1 hour
    @ 65°C
    24 hours
    @ 25°C
    MISC PROPERTIES:
    Volume Resistivity
    2.70e+13
    ohm-cm
    Hardness, Shore D
    79
    Lap shear
    3300 psi (Alum to Alum)
    GENERAL INFORMATION:
    For safe handling information on this product, consult the Material Safety Data Sheet, (MSDS).
    HOW TO USE:
    1)
    Carefully clean and dry all surfaces to be bonded.
    2)
    Apply
    AA-BOND FS291
    mixed adhesive to the prepared surfaces, and gently press these surfaces together. Contact pressure is adequate for strong, reliable bonds; however,
    maintain contact until adhesive is completely cured.
    3)
    Some separation of components is common during shipping and storage. For this reason, it is recommended that the contents of the shipping container be thoroughly mixed prior
    to use.
    4)
    Some ingredients in this formulation provided may crystallize when subjected to low temperature storage. A gentle warming cycle of 52°C for 30 minutes prior to mixing
    components may be necessary. Crystallized epoxy components do not react as well as liquid components and should be re-dissolved prior to use for best results.
    AVAILABILITY:
    This epoxy can be supplied in various different packages.
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