Integrated Circuits High Strength Silver Filled Epoxy Adhesive 1 Part AD1, 2.5gm

Description

Technical Product Bulletin
Heat Dry Electrically Conductive one part silver filled epoxy adhesive 5 gm
THIS PRODUCT DOES NOT CURE/HARDEN UNLESS HIGH HEAT IS APPLIED.
We have some different products that do not require heating.
G
ENER
A
L DESC
R
I
PTION:
This epoxy
is a single component epoxy, formulated with pure silver power combined wih organic binders and solvents
to produce
electrically conductive paths, films
or patterns over non-conductive substrates.
It
shows slight settling when stored for a long period of time, no caking and willre disperse to a smooth
homogeneous state.
·
This formulation produces electrically conductive paths on a wide variety of  surfaces including plastics, rubber, cloth,
thermoplastic, paper, wood and many others.
·
This compound
designed for use in diversified applications as microwave EMI & RFI shielding,in the assembly or repair
of printed circuit boards, wave-guides, electronic
modules, flat cable, static shielding, connections, and circuitry.
TYPICAL APPLICATIONS:
·
P
C
Bo
a
r
d
re
p
air
·
Elect
rop
lati
n
g
B
ase
·
Elect
ro-
f
o
r
m
ing
B
ase
·
P
ri
n
ted
C
irc
u
it
r
y
·
T
a
n
tal
u
m
C
a
p
acitors
·
Static
S
h
iel
d
ing
·
Elect
r
ical
G
a
m
es
a
n
d
t
o
y
s
·
R
ec
o
r
d
i
n
g
T
a
p
e
·
Micr
o
w
a
v
e
A
pp
licati
o
n
s
·
T
a
b
u
lati
n
g
C
a
rd
s
AP
P
LIC
A
TIO
N
:
This
c
o
n
d
u
cti
v
e
s
i
l
v
er
c
o
ated
is
f
o
r
mu
lated
f
o
r a
pp
licati
o
n
b
y
b
r
u
s
h
in
g
,
s
p
r
a
y
i
ng
,
d
ip
p
in
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,
b
a
n
d
ing
o
r
s
t
y
l
us
.
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ec
o
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ed
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y
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dd
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f
o
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i
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i
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al
c
o
m
po
s
i
tio
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,
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lace
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o
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k
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ig
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u
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s
.
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n
l
y
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e
rec
o
mm
e
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ed
thin
n
er
s
h
o
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ld
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e
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s
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d
. In
h
a
n
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ling
a
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u
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i
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o
r
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a
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ic
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o
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h
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reca
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n
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e
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ed
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y
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h
e
s
o
l
v
e
n
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pp
lier
s
h
o
u
ld
b
e
ob
s
e
r
v
e
d
S
P
EC
I
F
IC
A
TIONS:
The
sp
ec
i
f
i
c
a
t
i
on
s of this product mee
t
s
M
I
L
-
C
-
4
7
0
68
9
(
M
1)
(
1
)
1
2
AP
R
I
L
1990
specification for highly conductive, epoxy base silver coating material used for
electronic shielding
purposes.
PRODUCT PROPERTIES:
Appearance
Silver
Cure Type
Heat cure
Benefits
High strength
Perfect bond
EMI & RFI shielding
Wave guides
Substrates
Integrated Circuits
Aluminum
Copper
Magnesium
Steel
Bronze
Nickel
Kovar
Ceramic
Glass
Phenolic
G-10 epoxy glass boards.
Catalyst
Anhydride
Hardness, Shore D
83
UNCURED PROPERTIES:
Viscosity @ 25 °C cps
6,800
Density gm/cc
2.35
Silver , %
70-72
Shelf life
6 Months
Operating Temperature
-45°C to 170°C
Pot Life @ 25 °C
6 months @ 25°C
CURE SCHEDULE:
0.7 hours
@ 200°C, 392°F
1.5 hours
@ 180°C, 356°F
2.5 hours
@ 160°C, 320°F
PHYSICAL CHARACTERISTICS:
Sheet Resistivity
10-12 mΩ/sq
Bulk Resistivity
3x10-5Ω/cm
Adhesion Tensile Strength
1000 N/cm2 (1500 lb/in2)
Lap shear Strength
1400 N/cm2 (2000 lb/in2)
Thermal Conductivity
0.04J/(cm.s. °C):[0.01cal/(cm.s. °C)]
Specific heat
0.30J/(g. °C) :[0.07 cal/g. °C]
Coefficient of Thermal Expansion
3x10-5 (m/m)/ °C
Modulus of elasticity
4x1010 Pa (6x105lb/in2)
Poisson’s Ratio
0.35
GENERAL INFORMATION:
For safe handling information on this product, consult the Material Safety Data Sheet, (MSDS). HOW TO USE:
1)
Carefully clean and dry all surfaces to be bonded.
2)
Apply this product completely mixed adhesive to the prepared surfaces, and gently press these surfaces together. Contact pressure is adequate for strong, reliable
bonds; however, maintain contact
until adhesive is completely cured.
3)
Some separation of components is common during shipping and storage. For this reason, it is recommended that the contents of the shipping container be thoroughly
mixed prior to use.
4)
Some ingredients in this formulation provided may crystallize when subjected to low temperature storage. A gentle warming cycle of 52°C for 30 minutes prior to
mixing components may be
necessary. Crystallized epoxy components do not react as well as liquid components and should be re-dissolved prior to use for best results.
AVAILABILITY:
This epoxy can be supplied in various different packages.
***This product will cure only if heat activated****   Check out the two part epoxy listed here:
other items
! if you cannot use heat to cure the epoxy:
RECOMMENDED CURE:
H
eat
i
ng
to
40
-
50
°
C
w
ill
a
c
cel
e
r
a
te
the
d
r
y
i
ng
Ti
m
e. Lon
g
er
cu
r
e
sc
h
ed
u
les
m
ay
be
r
e
qu
i
red
to
o
p
ti
m
i
z
e prop
e
r
t
ie
s
.
T
e
m
pe
r
a
tu
r
e
°
C
(
°
F)
Ti
m
e (hr)
200(39
2
)
0.7
180(35
6
)
1.5
160(32
0
)
2.5
PRICES:
2.5 gm   Syringe
(.99)
+ Shipping Fee
5 gm      Syringe
(.99)
+ Shipping
Fee
10 gm    Syringe
(.99)
+ Shipping
Fee
50 gm    Jar
(3.99)
+ Shipping
Fee
100 gm  Jar
(9.99)
+ Shipping
Fee
250 gm  Jar
(9.99)
+ Shipping
Fee
500 gm  Jar
(,099.99)
+ Shipping
Fee
*
Cust
o
m
s si
ze
s a
r
e
a
v
a
il
a
b
le
u
po
n
r
e
qu
e
st
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