High Performance Thermal CPU Heat Sink Compound Paste, Grease 04, 1.5gm

Description

Technical Product Bulleti
n
High Performance Thermal Epoxy CPU Heat Sink Compound Paste 1.5gm
PRODUCT DESCRIPTION:
This product is an opaque white heat sink grease compound, which is applied to the base and mounting studs of transistor and diodes to provide a positive heat sink seal, this facilitates heat transfer away from electrical/electronic components and into heat sinks, thereby increasing the overall efficiency and performance of the device.
It is a grease like silicone material, heavily filled with efficient heat conductive zinc oxide and a binding agent, this combination promotes high thermal conductivity, high temperature stability, and the lowest amount of bleed and evaporation. This thermal compound resists changes in consistency temperatures up to 180°C; function as heat transfer media, durable dielectric insulation, barrier against environmental contaminants and as a stress-relieving shock and vibration absorbent over a wide temperature and humidity range.
This thermal paste is resistant to ozone and ultraviolet degradation and has good chemical and solvent stability, good interference between the heat producing device and the heat transfer media, and low surface tension that enables them to wet most surfaces. This product will not harden, dry, or melt after 1200 hours @ 205°C.
POT
E
N
T
I
A
L U
S
ES:
·
Effect
i
ve
the
r
mal
c
o
up
ler
f
o
r any
heat
sink d
e
vic
e
, CPU
to
h
eat si
n
k
·
A
u
t
o
m
o
t
i
ve
t
e
m
p
er
a
tur
e
-
s
ensi
n
g
de
v
i
c
es
·
Tem
p
erature
sen
s
o
rs
·
A
p
p
l
i
ed to
the ba
s
e a
n
d
m
o
un
ti
n
g
st
ud
s
o
f tra
n
sist
o
r
, dio
d
es
a
n
d
sil
i
c
o
n
e c
o
n
tr
o
l
l
ed re
c
tifiers
·
P
o
wer
tra
n
sis
t
o
rs
·
Dio
d
e
s,
s
e
m
i
c
o
ndu
c
t
o
rs
·
Thermal
Joi
n
ts
·
For any
de
v
i
ce
where
eff
i
c
i
ent
c
oo
l
in
g
is
re
qu
ired
·
P
o
tti
n
g
·
TEC
M
o
du
les
·
H
ar
d
ware
·
Tele
co
mm
un
ic
a
ti
o
n
s
·
Ri
gh
t
p
ro
du
ct
f
o
r
the
r
mal
ma
n
a
g
e
ment
·
H
i
gh-
v
o
lta
g
e
c
o
r
o
n
a su
p
p
r
essant in
c
o
nn
e
c
t
o
r
s
f
o
r fly
b
ack
tra
n
sfe
r
o
rs
l
o
c
a
ted
in TV s
e
ts.
·
N
o
n-
S
a
g
o
r f
l
o
wing
·
N
o
n-H
a
z
ar
d
o
u
s po
l
y
meri
z
a
ti
o
n
·
N
o
n-
T
o
xic
·
N
o
n-
Cor
r
o
si
v
e
·
Re
w
o
rka
b
le
.
Easily
r
e
m
o
ved
·
N
o
n-
F
l
a
m
ma
b
le
·
Easy
to
a
pp
ly
via
d
is
p
ensi
n
g
o
r s
c
reen pr
in
ti
n
g
·
L
o
w
su
r
fa
c
e
t
ensi
o
n
that
e
n
a
b
les it
t
o
wet
m
o
s
t su
r
f
a
ces, which
can
l
o
w
er the
t
h
e
r
m
al c
o
n
t
a
ct
r
esistan
c
e
b
e
tw
e
en the s
ub
stra
t
e
a
n
d
ma
t
eria
l
.
APP
L
I
C
A
T
ION
ME
T
HODS:
A
u
t
o
mated
o
r
ma
nu
al
d
is
p
ensi
n
g
U
S
A
G
E
I
N
S
TR
U
C
T
I
O
NS:
For i
ndu
strial
use
o
n
l
y
R
e
a
d
M
SDS
carefu
l
ly
pr
i
o
r
to
u
se.
S
T
OR
A
GE
H
A
N
D
L
I
N
G &
S
HELF
L
IFE:
This product
has
a shelf
life
o
f
5
years
at
r
o
o
m
t
e
m
p
er
a
ture (76°
F
)
in an
u
n
o
p
e
n
ed
c
o
n
t
ai
n
er, s
e
ttl
ing
s
may
o
c
cur
du
ri
n
g
l
o
n
g
te
r
m
s
t
o
ra
ge
,
it
is re
com
men
d
ed
t
o
r
e
-
m
i
x the filler
b
y ha
n
d
o
r mech
a
n
ical
m
ixi
n
g.
Keep
c
o
n
t
ai
ne
r ti
gh
tly
c
l
o
sed
s
t
o
re in
c
o
o
l
area a
w
ay
f
r
o
i
gn
it
i
o
n
s
o
u
rces
and
o
xi
d
i
z
ers,
n
o
s
p
ecial p
r
ecaut
i
o
n
s
n
eed
t
o
b
e tak
e
n
if p
r
o
du
ct
i
s ha
n
d
led acc
o
r
d
i
n
g
t
o
di
r
e
ct
i
o
n
s. S
h
elf l
i
fe is i
nd
ica
t
ed
o
n
the
p
r
o
d
u
ct
la
b
el, a
n
y sp
e
cial
s
t
o
r
a
g
e a
n
d
ha
n
d
l
in
g i
n
structio
n
s
will
b
e
p
r
in
ted
o
n
the p
r
o
d
u
ct
c
o
n
tai
n
er
la
b
el.
ELECTRICAL PROPERTIES:
Dielectric Strength, volts/mil
(ASTM D 150)
390
Dielectric Constant @ 100Hz
(ASTM D150)
4.40
Dissipation Factor @ 100Hz
(ASTM D150)
0.0021
Volume Resistivity, ohm-cm
(ASTM D257)
2.9x1
0
14
THERMAL PROPERTIES:
T
h
e
r
m
a
l
Co
n
ducti
v
ity
W/
m
-
K
0.88
Op
e
rati
n
g
T
e
m
p
e
rat
u
re
Ran
ge
,
°C
-6
0
to
205
T
h
e
r
m
a
l
R
e
s
i
s
tan
c
e
°
C
-
In
2
/W
0.05
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TY
P
I
C
AL
P
ROP
E
R
T
IES
&
CHE
M
I
C
A
L C
H
A
R
A
C
TE
R
I
STI
CS:
Color
White
Base Fluid
Di
me
t
h
yl
P
oly
s
iloxane
Filler
Zinc
oxide
Specific Gravity, 25°C, gm/cc
2.45
Viscosity
Pa
s
te
Press Flow @ 42.5 PSI, 25°C sec
13
Penetration (Worked), mm
28
5
1
/
10
Evaporation 24 hrs @25°C, %
0.0
Evaporation @ 200°C
24H by
weight,%
0.5
Bleed 24 Hours,%
0.6
AVAILABILITY:
This epoxy can be supplied in various different packages.