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Flexible Electrically Conductive Silver Epoxy Electrical Modules 2919, 2.5 gm

$ 8.97

Availability: 15 in stock
  • Packaging:: Pouch
  • Condition: New
  • All returns accepted: ReturnsNotAccepted
  • Brand: Atom Adhesives
  • Model: AA-DUCT 2919-2
  • Typical Application 3: flat cable and high frequency shields Electronic
  • Typical Applications 1: Assembly and repair of electrical modules
  • MPN: 2919-2
  • Benefits 2: Coatings between many different materials
  • Typical Applications 3: coating, and sealing applications Cold solder
  • Country/Region of Manufacture: United States
  • Benefits 1: ree of solvents and copper or carbon additives
  • Typical Applications 2: flexible circuits, membrane switches, wave guides

    Description

    Technical Product Bulletin
    FOOD & DRUG APPLICATION EPOXY ADHESIVE
    PRODUCT DESCRIPTION:
    AA-DUCT 2919 is a non-bleeding, electrically conductive, silver-filled epoxy formulation recommended for electronic bonding,
    coating, and sealing applications that require high flexibility coupled with good electrical and mechanical properties.
    This two-part, thixotropic adhesive of refined pure silver and epoxy resin components is free of solvents and copper or carbon
    additives. It develops resilient, electrically and thermally conducting bonds and coatings between many different and dissimilar
    materials such as metals, ceramics, glass and plastic insulates.
    AA-DUCT 2919 cures at room temperature and can be used as a flexible "cold-solder" for heat-sensitive components where
    hot-soldering is impractical. It also can be used for the assembly and repair of electrical modules, flexible circuits, membrane
    switches, wave guides, flat cable and high frequency shields.
    GENERAL DESCRIPTION:
    Appearance
    Silver
    Cure Type
    Room temperature or Heat cure
    Benefits
    Free of solvents and copper or carbon additives
    Coatings between many different and dissimilar substrates
    Mix Ratio by weight
    90:100 / Resin:Hardener
    Substrates
    Metal
    Ceramics
    Glass
    Thixotropic Index
    4.9
    Typicall Application
    Assembly and repair of electrical modules, flexible circuits, membrane switches, wave guides, flat cable and high frequency shields
    Electronic bonding, coating, and sealing applications
    Can be used as a flexible "cold-solder"
    CURE SCHEDULE:
    4 Hours
    @ 65 °C
    24 Hours
    @ 25 °C
    UNCURED PROPERTIES:
    Specific Gravity, mixed
    2.32 g/cc
    Pot Life
    30 mins
    Solid Content
    100%
    Volatile Organic Compounds (VOC) Content
    24.41 g
    Viscosity
    995000 cPs @ 25 °C
    MISC PROPERTIES:
    Shelf Life
    1 Year
    Hardness, Shore D
    80
    Adhesives Bond Strength
    Lap shear, alum to alum
    90 psi in 24hrs @ 25 °C
    170 psi in 4hrs @ 65 °C
    ELECTRICAL PROPERTIES:
    Volume Resistivity
    0.00011 ohm-cm
    cured 4 hrs @ 65 °C
    0.0016 ohm-cm
    cured 24hrs @ 25 °C
    THERMAL PROPERTIES:
    CTE, linear
    19.4 μin/in-°F @ 68 °F
    Thermal Conductivity
    11.1 BTU-in/hr-ft²-°F
    Operating Temperature
    -60.0 °C to 110 °C
    Glass Transition Temp, Tg
    4.00 °C, 39.2 °F
    GENERAL INFORMATION:
    For safe handling information on this product, consult the Material Safety Data Sheet, (MSDS).
    HOW TO USE:
    1)
    Carefully clean and dry all surfaces to be bonded.
    2)
    Apply AA-DUCT 2919 completely mixed adhesive to the prepared surfaces, and gently press these surfaces together. Contact
    pressure is adequate for strong, reliable bonds; however, maintain contact until adhesive is completely cured.
    3)
    Some separation of components is common during shipping and storage. For this reason, it is recommended that the contents of
    the shipping container be thoroughly mixed prior to use.
    4)
    Some ingredients in this formulation provided may crystallize when subjected to low temperature storage. A gentle warming
    cycle of 52°C for 30 minutes prior to mixing components may be necessary. Crystallized epoxy components do not react as well as
    liquid components and should be re-dissolved prior to use for best results.
    AVAILABILITY:
    This epoxy can be supplied in various different packages.
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