-40%

Electrically Conductive Nickel Epoxy Adhesive 1 Part Heat Cure N02, 2.5gm

$ 9.49

Availability: 97 in stock
  • Typical Applications 1:: Electrical, conductive, rmi efi shielding
  • All returns accepted: ReturnsNotAccepted
  • Brand: Atom Adhesives
  • Condition: New
  • Benefits 2:: Cold solder for high-sensitive components
  • Benefits 1:: High strength Perfect bond
  • Typical Applications 2:: circuitry printed circuit board electronics repair
  • Model: AA-DUCT N02-2
  • MPN: N02-2
  • Country/Region of Manufacture: United States

    Description

    Technical Product Bulletin
    NICKEL FILLED ELECTRICALLY CONDUCTIVE EPOXY
    THIS PRODUCT DOES NOT CURE/HARDEN UNLESS HIGH HEAT IS APPLIED.
    We have some different products that do not require heating.
    PRODUCT DESCRIPTION:
    AA-DUCT N02
    is a single component, heat curing, conductive epoxy
    polymer that was designed for ease in handling. This high
    performance conductive polymer cures quickly at elevated
    temperatures making it ideally suited for rapid
    Processing and
    assembly.
    AA-DUCT N02
    passes NASA’s outgassing testing (ASTM E-595) and is
    listed in NASA’s Outgassing Data for Selecting Spacecraft Materials
    list.
    AA-DUCT N02
    offers excellent mechanical, electrical, and physical
    properties at continuous operating Temperatures up To 175°C. This
    versatile Nickel conductive adhesive can be used for chip bonding in
    Micro and electronic hybrid
    circuit Fabrication. This unique
    conductive polymer also exhibits outstanding adhesion to a wide
    variety of substrates with good hot strength at intermittent
    temperatures up to 325°C.
    AA-DUCT N02
    has also been used in microwave applications for EMI and  FRI shielding, for assembly and repair of circuit boards and
    Electronic component manufacturing.
    PRODUCT PROPERTIES:
    Base
    Epoxy
    Appearance
    Grey
    Cure Type
    Heat cure or Room temperature
    Benefits
    ·
    High strength
    ·
    Perfect bond
    ·
    Cold solder for heat sensitive components
    Mix Ratio by weight
    100:6 / Resin:Hardener
    Substrates
    ·
    Integrated Circuits
    ·
    Aluminum
    ·
    Copper
    ·
    Magnesium
    ·
    Steel
    ·
    Bronze
    ·
    Nickel
    ·
    Kovar
    ·
    Ceramic
    ·
    Glass
    ·
    Phenolic
    ·
    G-10 epoxy glass boards.
    Operating Temperature
    -60 to 110 °C
    Viscosity
    Soft Paste
    Shelf Life
    6 months
    CURED PROPERTIES:
    Hardness, Shore D
    88
    Volume Resistivity ohm-cm
    3.8 x 10-2
    CURE SCHEDULE:
    2 Hours
    @ 125°C
    1 hour
    @ 150°C
    30 min
    @ 175 °C
    THERMAL CHARACTERISTICS:
    Thermal Conductivity, Btu/hr/ft2/°F/in:
    10.1
    Operating Temp. Range, °C:
    -55 to +175
    NASA OUTGASSING RESULTS :
    TTML
    (Total Mass Loss)
    % 0.25
    CVCM
    (Collected Volatile Condensable Materials
    )
    % 0.00
    WVR
    (Water Vapor Recovery)
    % 0.07
    GENERAL INFORMATION:
    For safe handling information on this product, consult the
    Material Safety Data Sheet, (MSDS
    ).
    HOW TO USE:
    1.
    Carefully clean and dry all surfaces to be bonded.
    2.
    Apply
    AA-DUCT N02
    completely mixed adhesive to the prepared surfaces, and gently press these surfaces together. Contact pressure is adequate for strong, reliable bonds;
    however, maintain contact until adhesive is completely
    cured.
    3.
    Some separation of components is common during
    that the contents of the shipping container be thoroughly mixed prior to use.
    4.
    Some ingredients in this formulation provided may crystallize when subjected to low temperature storage. A gentle warming cycle of 52°C for 30 minutes prior to mixing components may be necessary. Crystallized epoxy components do not
    react as well as liquid components and should be re-dissolved prior to use for best results.
    AVAILABILITY:
    This epoxy can be supplied in many different packages.
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