60 Minutes Cure Silver Epoxy Thermally Conductive Repair Kit 902, 2.5 grams

Description

Technical Product Bulletin
60 minutes
Silver Conductive epoxy
PRODUCT DESCRIPTION:
This 60 Minute Conductive Epoxy is a two part,
silver epoxy used in prototype, repair and
general solder-less conductive bonding
applications. It features
strong mechanical
bonds, superior electrical conductivity, and
extended pot life for increased work time.
Components can be easily placed and replaced
before full cure occurs within 24 hours at room temperate or accelerated cure by heat cure at (100˚C) 212
˚
F for 60 minutes.
This
conductive epoxy bonds
strongly to a wide
selection of materials/substrates.
60 minutes
epoxy is an adhesive and coating formulation based on pure
silver.  This versatile silver
formulation offers the maximum continuity of conductivity
with an electrical resistivity value of less than 1
x
10
-4
ohm·cm.
60 minutes
epoxy
is also characterized by a wide operating temperature range from –50 to +170°C.
It
is recommended for electronic bonding and
sealing
applications that require both fine electrical and mechanical properties.
GENERAL PROPERTIES:
Appearance
Silver
Cure Type
Heat cure or Room Temperature
Benefits
High strength
Perfect bond
Cold solder for heat sensitive components
60 minutes work time offers increased workability and extended pot life
Mix Ratio by weight
100:5 / Resin: Hardener
Substrates
Excellent choice aluminum, copper, magnesium, steel, bronze, nickel, kovar, ceramic, glass, phenolic and G-10 epoxy glass boards.
Typical Applications
Electrical, conductive, rmi/efi shielding, circuitry, printed circuit board and electronics repair
UNCURED PROPERTIES:
Viscosity @ 25 °C  cps
Paste
Specific Gravity, mixed
2.79
Reactive solids contents, %
100
Pot Life
60 Minutes
Shelf life
1 year
CURE SCHEDULE:
2 – 5 minutes
@ 150°C
15 minutes
@ 100°C
45 minutes
@ 50°C
24  hours
Room temperature
CURED PROPERTIES:
Hardness, Shore D
85
Shrinkage linear in/in
0.0003
Lap shear strength, psi
9400
Volume Resistivity ohm. cm
< 0.0001
Thermal Expansion Coefficient,
(cm / cm / °C · 10-5)
1.5
Thermal Conductivity,
btu / hr / ft2 / °F / in:
100
Tensile Strength, psi:
9,500
Compressive Strength, psi
14,000
Heat Distortion, °C
95
Operating Temperature
-50°c to +170°c
GENERAL INFORMATION:
For safe handling information on this product, consult the Material Safety Data Sheet, (MSDS).
HOW TO USE:
1)
Carefully clean and dry all surfaces to be bonded.
2)
Apply
60 minutes
epoxy
completely mixed adhesive to the prepared surfaces, and gently press these surfaces together. Contact pressure is adequate for strong,
reliable bonds; however, maintain contact until adhesive is completely cured.
3)
Some separation of components is common during shipping and storage. For this reason, it is recommended that the contents of the shipping container be
thoroughly mixed prior to use.
4)
Some ingredients in this formulation provided may crystallize when subjected to low temperature storage. A gentle warming cycle of 52°C for 30 minutes prior
to mixing components may be necessary. Crystallized epoxy components do not react as well as liquid components and should be re-dissolved prior to use for
best results.
AVAILABILITY:
This epoxy can be supplied in various different packages.
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